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Particle and Thin Film Adhesion

By Stephen Beaudoin1, Ravi Jaiswal1, Caitlin Kilroy1

1. Purdue University

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Abstract

image The adhesion of micron and sub-micron scale particles to surfaces is of tremendous interest in a wide range of industrial and civilian applications. We measure directly the adhesion of particles to surfaces using atomic force microscopy and develop experimentally-validated, science-based models for the adhesion. The models consider electrostatic, van der Waals, and hydrophobic interactions for rough, deformable particles with nonuniform geometry adhering to rough deformable surfaces in liquid, gaseous, or vacuum environments.

These efforts are currently being applied to improve wafer cleaning and polishing processes in the semiconductor industry, to assist in the detection of weapons and explosives, and to facilitate the development and implementation of biomaterials with optimal surface properties.

Cite this work

Researchers should cite this work as follows:

  • Stephen Beaudoin; Ravi Jaiswal; Caitlin Kilroy (2007), "Particle and Thin Film Adhesion," https://pharmahub.org/resources/29.

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Tags

  1. Fast fourier transform
  2. Hamaker constants
  3. Particle adhesion
  4. Surface roughness
  5. Thin films
  6. Van der waals force

In This Series

  1. Simulation of the Adhesion of Particles to Surfaces

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    20 Dec 2007 | Publications | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy

    The removal of micrometer and submicrometer particles fromdielectric and metal films represents a challenge in postchemicalmechanical polishing cleaning. Proper modeling of the adhesiveforce between contaminant particles and these films is needed todevelop optimal solutions to postchemical...

  2. Hamaker Constants in Integrated Circuit Metallization

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    20 Dec 2007 | Publications | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy

    A new method for determining Hamaker constants was examinedfor materials of interest in integrated circuit manufacture. Anultra-high vacuum atomic force microscope and an atomic force microscopeoperated in a nitrogen environment were used to measurethe interaction forces between metals,...

  3. A Theoretical and Experimental Study of Surface Forces in Adhesion of Particles to Thin Films

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    20 Dec 2007 | Publications | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy

    The interactions between micron- and nano-particles and rough surfaces are of great importance and have numerous applications in surface science and biotechnology. It is essential to have estimates of surface/intermolecular forces between interacting bodies to describe and to manipulate the...

  4. Roughness models for particle adhesion

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    20 Dec 2007 | Publications | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy

    The effects of different surface roughness models on a previously developed van der Waals adhesion model were examined. The van der Waals adhesion model represented surface roughness with a distribution of asperities. It was found that the constraints used todefine the asperity distribution on...

  5. Particle Adhesion

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    07 Jan 2008 | Tools | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy, Dave Balachandran

    Particle Adhesion

  6. Basic Forces in Particle Adhesion

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    28 Jan 2008 | Online Presentations | Contributor(s): Stephen Beaudoin

    Particle adhesion to surfaces is important in a wide range of industrial applications. This brief presentation is designed to provide an introduction to the forces that influence particle adhesion in air or liquid environments. It is not designed to provide information at great depth or...

  7. Discussion on Hamaker Constant

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    09 May 2008 | Publications | Contributor(s): Stephen Beaudoin, Ravi Jaiswal, Caitlin Kilroy

    The Hamaker constant is a force constant used for describing the van der Waals (vdW) force. The magnitude of the Hamaker constant reflects the strength of the vdW force between two particles, or between a particle and a substrate. It depends on the material properties of both the interacting...